Chinese Scientists Pioneer Ultra-Thin Semiconductor Material for Next-Gen Chips
A team of Chinese researchers has achieved a landmark breakthrough in semiconductor technology, creating an ultra-thin semiconductor material just 0.7 nanometres thick. Led by Liu Kaihui, Liu Can, and Zhang Guangyu, this innovation addresses critical challenges in silicon-based chip miniaturization and paves the way for ultra-efficient microchips. Published in Science, the study highlights a revolutionary fabrication method that ...
